A series of mRF prototypes consisting of a contact mechanism and actuator with return spring were fabricated assembled, inspected, and characterized for electromechanical performance. Characterization results led to specific conclusions regarding capabilities of the mRF product, and the integrated manufacturing technique.

The performance objectives of low RF loss, high electrical isolation, and device compactness drive the fabrication requirements for modern RF relays. To realize these goals, advanced manufacturing systems must process high-conductivity metals and low-loss tangent dielectrics with well-controlled material properties and dimensional tolerances to obtain precise actuation and contact resistance for consistent electrical response.

The research provides a practical new product application for integrated mesoscale rapid manufacturing. Methods and infrastructure for reliable batch assembly of electromechanical actuators and structural parts less than 5?mm3 in volume are described. Switches made using these techniques are expected to have greater Power handling capability relative to current micro RF relay products.

Future products require increasingly compact, high power transmitters for functions including Communications and telemetry, remote sensing, and radio frequency identification tags. This work represents one of the first examples of a mesoscale relay rapidly manufactured with a combination of µEDM and SL components.
Source: The complete article is available at http://www.emeraldinsight.com/Insight/viewContentItem.do?contentType=Article&contentId=1558306

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